3M and IBM to develop new types of adhesives to create 3D semiconductors

Sep 08, 2011
IBM and 3M Corp. are developing a new type of electronic “glue” that can be used to build stacks of semiconductors - 3D chips. The glue, shown in blue above, connects up to 100 separate chips as it conducts heat away from the silicon package. The innovation will create microprocessors 1,000 times more powerful than today’s PC chips.

3M and IBM announced that the two companies plan to jointly develop the first adhesives that can be used to package semiconductors into densely stacked silicon “towers.” The companies are aiming to create a new class of materials, which will make it possible to build, for the first time, commercial microprocessors composed of layers of up to 100 separate chips.

Such stacking would allow for dramatically higher levels of integration for information technology and consumer electronics applications. Processors could be tightly packed with memory and networking, for example, into a “brick” of silicon that would create a computer 1,000 times faster than today’s fastest microprocessor enabling more powerful smartphones, tablets, computers and gaming devices. 

The companies’ work can potentially leapfrog today’s current attempts at stacking chips vertically – known as 3D . The joint research tackles some of the thorniest technical issues underlying the industry’s move to true 3D chip forms. For example, new types of are needed that can efficiently conduct heat through a densely packed stack of chips and away from heat-sensitive components such as logic circuits. 

This video is not supported by your browser at this time.

“Today's chips, including those containing ‘3D’ transistors, are in fact 2D chips that are still very flat structures,” said Bernard Meyerson, VP of Research, . “Our scientists are aiming to develop materials that will allow us to package tremendous amounts of computing power into a new form factor – a silicon ‘skyscraper.’ We believe we can advance the state-of-art in packaging, and create a new class of that offer more speed and capabilities while they keep power usage low -- key requirements for many manufacturers, especially for makers of tablets and smartphones.”  

Many types of semiconductors, including those for servers and games, today require packaging and bonding techniques that can only be applied to individual chips. and IBM plan to develop adhesives that can be applied to wafers, coating hundreds or even thousands of chips at a single time. Current processes are akin to frosting a cake slice-by-slice. 

Under the agreement, IBM will draw on its expertise in creating unique semiconductor packaging processes, and 3M will provide its expertise in developing and manufacturing adhesive materials. 

“Capitalizing on our joint know-how and industry experience, 3M looks forward to working alongside IBM – a leader in developing pioneering packaging for next-generation semiconductors,” said Herve Gindre, division vice president at 3M Electronics Markets Materials Division. “3M has worked with IBM for many years and this brings our relationship to a new level. We are very excited to be an integral part of the movement to build such revolutionary 3D packaging.”

Explore further: Google searches hold key to future market crashes

add to favorites email to friend print save as pdf

Related Stories

Big steps in creating small chips

Nov 04, 2010

(PhysOrg.com) -- Plastic, heated in a simple microwave oven, is the technique researchers at the University of Alberta and the National Institute for Nanotechnology believe could help to re-invent the manufacture ...

Recommended for you

Google searches hold key to future market crashes

8 hours ago

A team of researchers from Warwick Business School and Boston University have developed a method to automatically identify topics that people search for on Google before subsequent stock market falls.

Lenovo's smart glasses prototype has battery at neck

10 hours ago

China's PC giant Lenovo last week offered a peek at its Google Glass-competing smart glass prototype, further details of which are to be announced in October. Lenovo's glasses prototype is not an extreme ...

Amazon launches 3D printing store

13 hours ago

Amazon announced Monday the launch of an online store for 3D printed items to allow consumers to customize and personalize items like earrings, pendants, dolls and other objects.

User comments : 1

Adjust slider to filter visible comments by rank

Display comments: newest first

nicknick
not rated yet Sep 11, 2011
First invent transistors that are consuming 1000 times less power. Then maybe you can think of stacking a 1000 chips.