ASM, IMEC Demonstrate Tree Generations of Aurora Low-K Materials

Dec 06, 2006

ASM International and IMEC announce that they have demonstrated three generations of ASM’s Aurora® low-k and SiC dielectric barrier materials for IMEC’s 300mm pilot line.

These results have been established within the framework of the ASM - IMEC strategic partnership on Back-end-of-Line (BEOL) interconnect technology, which was announced on July 12, 2005. In this strategic partnership, IMEC and ASM will develop novel copper/low-k interconnects on 300mm wafers for application in chips of the nanotechnology era, with feature sizes of 45nm or less.

"The Aurora materials are known for their superior mechanical properties," comments Tominori Yoshida, ASM’s Business Unit Manager for PECVD. "Better mechanical properties, such as elastic modulus and hardness, and small pore size, usually makes materials more suitable for integration in a multi-layer interconnect and packaging", he continues. As with the first generation material, the next generations Aurora ultra low-k materials have also been demonstrated by IMEC to have excellent mechanical properties with, for example, an elastic modulus exceeding 9 GPa at a k value of 2.5, at a pore diameter less than 2nm.

These porous Extreme Low-k layers have been successfully patterned by IMEC with ArF immersion lithography into features suitable for 45nm to 32nm device interconnect wiring.

"We are pleased that we can offer our partners the low-k materials and technologies that they need, not only for our baseline interconnect process but also for advanced development for 45nm and 32nm technology. To this end, IMEC collaborates with leading equipment and materials suppliers worldwide to offer our IDM partners all possible options for future technology development" stated Luc Van den hove, IMEC’s Vice President Silicon Process and Device Technology.

As part of the continuing strategic partnership, IMEC and ASM will research multi-layer integrations of Aurora Extreme Low-k films (k<2.5) and the feasibility of even lower k-values, suitable for sub 32 nm technologies. ASM has installed two Eagle platforms in IMEC’s 300mm pilot line to provide low-k deposition capabilities for Aurora materials with k values ranging from about 3.0 to about 2.3, and SiC dielectric barrier layers with k values ranging from about 5.0 to about 3.8. This set of available materials spans multiple generations of low-k implementations down to the 22nm technology node.

Source: ASM Int.

Explore further: Infineon offers application optimized bipolar power modules introducing cost-effective solder bond modules

add to favorites email to friend print save as pdf

Related Stories

Algorithm, not live committee, performs author ranking

1 hour ago

Thousands of authors' works enter the public domain each year, but only a small number of them end up being widely available. So how to choose the ones taking center-stage? And how well can a machine-learning ...

Senators get no clear answers on air bag safety

11 hours ago

There were apologies and long-winded explanations, but after nearly four hours of testimony about exploding air bags, senators never got a clear answer to the question most people have: whether or not their ...

Nicaragua: Studies say canal impact to be minimal

11 hours ago

Officials said Thursday that studies have determined a $40 billion inter-oceanic canal across Nicaragua will have minimal impact on the environment and society, and construction is to begin next month.

Recommended for you

Namibia prepares for Africa's first e-vote

3 hours ago

Namibia will vote in Africa's first electronic ballot Friday, a general election that will usher in a new president and quotas to put more women in government.

GoGlove wearable aims to control life's soundtracks

5 hours ago

Technology creatives are seeing the key attraction in wearables as being in solutions that save the user from fumbling around with the phone to make app adjustments or changes, or from repeatedly taking it ...

Amazon cuts Fire phone price to ignite sales

6 hours ago

Amazon on Wednesday slashed the price of Fire mobile phones that stalled after launch early this year, becoming a drag on the US online retail titan's bottom line.

User comments : 0

Please sign in to add a comment. Registration is free, and takes less than a minute. Read more

Click here to reset your password.
Sign in to get notified via email when new comments are made.