Samsung Develops Advanced Packaging Technology to Achieve a 0.6mm-thick 8-chip Package

Nov 05, 2009

Samsung Electronics announced today that it has developed the world's thinnest multi-die package, one that measures a mere 0.6mm in height. Designed initially for 32 gigabyte (GB) densities, the new memory package is just half the thickness of a conventional memory package of eight stacked chips (or dies). The advanced packaging technology delivers a 40 percent thinner and lighter memory solution for high-density multimedia handsets and mobile devices.

"Thin remains the action word in today's mobile environment and we're taking a big step here at Samsung to make higher density memory less than half the thickness of what it was before," said Jim Elliott, vice president, memory marketing, Samsung Semiconductor, Inc.

The new ultra thin package features a significantly thinner "bare" die that measures only half the thickness of a conventional die. The new 0.6mm-thick package, which consists of eight identical dies (called an octa-die package), uses 30-nanometer class, 32 gigabit (Gb) NAND flash chips, each measuring just 15um*, to deliver a 32 gigabyte (GB) NAND solution.

The newly developed ultra-thinning technology overcomes the conventional technology limits of a chip's resistance to external pressure when under 30um in height. The productivity decline resulting from this thickness limitation had been directly attributable to a drop in production yields during mass production.

The 15um-thickness represents a significant achievement as it can allow for double the density of previous multi-chip packages. The thinner die also dramatically reduces chip weight.

In addition, the new package technology can be adapted to other existing MCPs, configured as system in packages (SiPs), or package on packages (PoPs). The breakthrough technique for 15um-and-under chip thicknesses will allow for the design of very high density solutions with the smallest of form factors - an extremely attractive prospect for the highly competitive mobile market.

"We have achieved a major reduction in the thickness and weight of a large multi-die package to provide the best solution for combining higher density with multi-functionality in current mobile designs," said Tae-Gyeong Chung, vice president, test and package center, package development team, . "A package height under 1mm will provide set designers with much greater freedom in creating attractive designs that satisfy the diverse styles and thin-focused tastes of consumers today."

According to market research firm, iSuppli, for memory cards of 2GB densities and higher, 310 million units are expected to be produced in 2009 (60 percent of total production), a number projected to grow to 7.7 billion units by 2012 (89 percent of total production).

Moreover, iSuppli estimates the portion of memory cards 16GB and higher to be 35 million units (16GB equivalents) this year, a number expected to reach 530 million units by 2012 - representing a, a 15-fold growth spurt. This portion of the overall card production would jump from 33 percent to 74 percent during the same period.

Source: Samsung

Explore further: Infineon offers application optimized bipolar power modules introducing cost-effective solder bond modules

add to favorites email to friend print save as pdf

Related Stories

Samsung Produces 60-Nanometer 8-Gigabit NAND Flash Memory

Jul 19, 2006

Samsung Electronics today announced that it has begun mass producing an 8-Gigabit (Gb) NAND flash memory device, providing a much larger and more affordable storage density for consumer and mobile applications ...

Recommended for you

Audi to develop Tesla Model S all-electric rival

2 hours ago

The Tesla Model S has a rival. Audi is to develop all-electric family car. This is to be a family car that will offer an all-electric range of 280 miles (450 kilometers), according to Auto Express, which ...

A green data center with an autonomous power supply

7 hours ago

A new data center in the United States is generating electricity for its servers entirely from renewable sources, converting biogas from a sewage treatment plant into electricity and water. Siemens implemented ...

After a data breach, it's consumers left holding the bag

8 hours ago

Shoppers have launched into the holiday buying season and retailers are looking forward to year-end sales that make up almost 20% of their annual receipts. But as you check out at a store or click "purchase" on your online shopping cart ...

Can we create an energy efficient Internet?

8 hours ago

With the number of Internet connected devices rapidly increasing, researchers from Melbourne are starting a new research program to reduce energy consumption of such devices.

Brain inspired data engineering

9 hours ago

What if next-generation ICT systems could be based on the brain's structure and its cognitive and adaptive processes? A groundbreaking paradigm of brain-inspired intelligent ICT architectures is being born.

User comments : 0

Please sign in to add a comment. Registration is free, and takes less than a minute. Read more

Click here to reset your password.
Sign in to get notified via email when new comments are made.