A completely new method of manufacturing the smallest structures in electronics could make their manufacture thousands of times quicker, allowing for cheaper semiconductors. The findings have been published in the latest ...
Nanophysics
Nov 28, 2012
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(Phys.org)—Electronic circuits are typically integrated in rigid silicon wafers, but flexibility opens up a wide range of applications. In a world where electronics are becoming more pervasive, flexibility is a highly desirable ...
Nanomaterials
Nov 26, 2012
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Fujitsu Semiconductor announced that it achieved high output power of 2.5kW in server power supply units equipped with gallium-nitride (GaN) power devices built on a silicon substrate. Fujitsu Semiconductor aims to start ...
Electronics & Semiconductors
Nov 22, 2012
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Fujitsu Semiconductor today announced that it successfully achieved high output power of 2.5kW in server power supply units equipped with gallium-nitride (GaN) power devices built on a silicon substrate. Fujitsu Semiconductor ...
Electronics & Semiconductors
Nov 8, 2012
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The recently developed ability to measure physical changes in silicon when processed into microelectronic devices could improve fabrication techniques for even smaller circuits.
Electronics & Semiconductors
Nov 7, 2012
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(Phys.org)—Inspired by phenomena common to both earthquakes and atomic force microscopy, University of Wisconsin–Madison materials engineers have learned that chemical reactions between two silicon dioxide surfaces cause ...
Condensed Matter
Nov 7, 2012
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(Phys.org)—Michael Hochberg joined the University of Delaware in the spring of 2012 as an associate professor in electrical and computer engineering.
Optics & Photonics
Oct 18, 2012
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(Phys.org)—Scientists at the U.S. Department of Energy's National Renewable Energy Laboratory (NREL) have produced solar cells using nanotechnology techniques at an efficiency – 18.2%—that is competitive. The breakthrough ...
Nanophysics
Oct 15, 2012
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Researchers sponsored by Semiconductor Research Corporation (SRC) today announced that they have developed a new laser-based method for ultra-fast anneal of thin photoresist films used to transfer semiconductor patterns onto ...
Electronics & Semiconductors
Oct 3, 2012
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(Phys.org)—University of Illinois researchers have a new low-cost method to carve delicate features onto semiconductor wafers using light – and watch as it happens.
Nanophysics
Sep 28, 2012
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