Elpida Memory today announced that it has begun sample shipments of the industry's first DDR3 SDRAM (x32-bit I/O configuration) made using TSV (Through Silicon Via) stacking technology. The sample is a low-power 8-gigabit ...
Electronics & Semiconductors
Jun 28, 2011
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SanDisk Corporation, the global leader in flash memory cards, today announced its next generation of iNAND and iNAND Ultra embedded flash drives featuring smaller and thinner form factors. Available in packages as small as ...
Hardware
Feb 14, 2011
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Reusable and recyclable packaging are shooting up the news, public, and political agenda, and increasingly can offer a cutting edge to the growing number of environmentally-conscious consumers. But what makes a refillable ...
Other
May 13, 2009
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