(PhysOrg.com) -- One of the more interesting areas of technological development in the coming years is likely to be energy development -- specifically green energy development. With new advances in physics allowing for such ...
Researchers at the Technische Universitaet Muenchen (TUM) are showing the way toward low-cost, industrial-scale manufacturing of a new family of electronic devices. A leading example is a gas sensor that could be integrated ...
Nanomaterials
Sep 25, 2013
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Polymer nano-films and nano-composites are used in a wide variety of applications from food packaging to sports equipment to automotive and aerospace applications. Thermal analysis is routinely used to analyze materials for ...
Nanophysics
Jan 12, 2012
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The head of the federal government's effort to promote solar technology told about 200 industry leaders yesterday that expanding the industry to the level needed by 2030 will require unprecedented levels of growth.
Energy & Green Tech
Feb 6, 2009
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The Electronics and Telecommunications Research Institute (ETRI) and IT Engineering, a Korean electric vehicle producer, have jointly developed a smartphone software package for calling and moving a self-driving car with ...
Automotive
Dec 6, 2018
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The Broad Institute of MIT and Harvard will release version 4 of the industry-leading Genome Analysis Toolkit under an open source software license. The software package, designated GATK4, contains new tools and rebuilt architecture. ...
Biotechnology
May 25, 2017
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Global technology giants Microsoft, Apple and Adobe were Monday ordered to appear before a pricing inquiry examining the often-higher cost of tech goods in Australia compared with other economies.
Business
Feb 11, 2013
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Fujitsu Laboratories today announced the development of a new packaging technology that enables the development of millimeter-wave power amplifiers that can be employed in applications such as automotive radar and wireless ...
Electronics & Semiconductors
Oct 29, 2012
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(PhysOrg.com) -- Small. Fast. Precise. A new electronics manufacturing technology developed at NDSU’s Center for Nanoscale Science and Engineering eliminates challenges facing conventional packaging techniques and shows ...
Electronics & Semiconductors
Nov 18, 2011
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Samsung Electronics today announced the development of 32 gigabyte (GB) double data rate-3 (DDR3) registered dual Inline memory modules (RDIMMs) that use three dimensional (3D) through silicon via (TSV) package technology.
Hardware
Aug 18, 2011
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