Samsung develops 30nm-class 32GB green DDR3 for next-generation servers

August 18, 2011, Samsung

Samsung Electronics today announced the development of 32 gigabyte (GB) double data rate-3 (DDR3) registered dual Inline memory modules (RDIMMs) that use three dimensional (3D) through silicon via (TSV) package technology.

Samsung’s advanced 30 nanometer (nm) class technology leverages module performance and power features to deliver a substantially greener solution than the preceding 40nm-class based modules. Engineering samples have been released for evaluation.

“These 32GB RDIMMs fully support the high-density and high-performance requirements of next-generation high-capacity servers,” said Wanhoon Hong, executive vice president, memory sales & marketing, Device Solutions, . “We will keep providing memory solutions with higher performance and density, while enhancing shared value in the design of ever-greener server systems,” he added.

The new 32GB RDIMM with 3D TSV package technology is based on Samsung's 30nm-class four gigabit (Gb) DDR3. It can transmit at speeds of up to 1,333 megabits per second (Mbps), a 70 percent gain over preceding quad-rank 32GB RDIMMs with operational speeds of 800Mbps.

Further, the 32GB-module consumes a mere 4.5 watts per hour – the lowest power consumption level among memory modules adopted for use in enterprise servers. Compared to the 30nm-class 32GB load-reduced, dual-inline memory module (LRDIMM), which offers advantages in constructing 32GB or higher memory solutions, the new 32GB module provides approximately 30 percent additional energy savings.

These savings are directly attributable to the adoption of TSV technology, which enables a multi-stacked chip to function at levels comparable to a single chip by shortening signal lines significantly, thereby lowering power consumption and achieving higher density and operational speed.

Samsung has collaborated with CPU and controller designers in addition to some current server system customers to facilitate quicker adoption of 3D-TSV server modules, and to pave the way for more easily supporting 32GB and higher-density based on 20nm-class for use in high-capacity servers.

Explore further: Samsung Ships 40nm-class, 32-Gigabyte Memory Module for Server Applications

Related Stories

Samsung Expands Green Line-up with 40nm-class 4Gigabit DDR3

February 24, 2010

Samsung Electronics announced today that it has begun mass producing the industry’s first low-power (green) four gigabit (Gb) DDR3 devices using 40 nanometer (nm) class process technology. The high-density memory is expected ...

Recommended for you

Researchers find tweeting in cities lower than expected

February 20, 2018

Studying data from Twitter, University of Illinois researchers found that less people tweet per capita from larger cities than in smaller ones, indicating an unexpected trend that has implications in understanding urban pace ...

Augmented reality takes 3-D printing to next level

February 20, 2018

Cornell researchers are taking 3-D printing and 3-D modeling to a new level by using augmented reality (AR) to allow designers to design in physical space while a robotic arm rapidly prints the work.

What do you get when you cross an airplane with a submarine?

February 15, 2018

Researchers from North Carolina State University have developed the first unmanned, fixed-wing aircraft that is capable of traveling both through the air and under the water – transitioning repeatedly between sky and sea. ...

1 comment

Adjust slider to filter visible comments by rank

Display comments: newest first

EWH
not rated yet Aug 29, 2011
"consumes a mere 4.5 watts per hour"

should be: "consumes a mere 4.5 watts"

Watts measure energy per second, not energy.

Please sign in to add a comment. Registration is free, and takes less than a minute. Read more

Click here to reset your password.
Sign in to get notified via email when new comments are made.