Samsung Electronics today announced the development of 32 gigabyte (GB) double data rate-3 (DDR3) registered dual Inline memory modules (RDIMMs) that use three dimensional (3D) through silicon via (TSV) package technology.
Hardware
Aug 18, 2011
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(AP) -- Software maker Adobe Systems Inc. posted higher net income for its most recent quarter, driven by strong demand for the software package it sells to professional designers and developers.
Business
Jun 22, 2010
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Samsung Electronics announced today that it has developed the world's thinnest multi-die package, one that measures a mere 0.6mm in height. Designed initially for 32 gigabyte (GB) densities, the new memory package is just ...
Electronics & Semiconductors
Nov 5, 2009
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President Barack Obama announced on Tuesday that his administration plans to spend $3.4 billion on producing a safer, more efficient electrical grid. Obama underscored the need to find clean forms of energy by making his ...
Energy & Green Tech
Oct 29, 2009
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Elpida Memory today announced that it has completed development of a Cu-TSV (Through Silicon Via) multi-layer 8-Gigabit DRAM.
Electronics & Semiconductors
Aug 31, 2009
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(AP) -- Tessera Technologies Inc. said Wednesday that it won a patent dispute over small-format semiconductor packaging products, with the International Trade Commission issuing a cease-and-desist order against rivals Motorola ...
Business
May 21, 2009
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NEC Corporation announced today the development of chip-stacked flexible memory, which can be used to achieve a new system-on-chip (SoC) architecture. The new SoC's architecture consists of separate logic (excluding embedded ...
Electronics & Semiconductors
Feb 10, 2009
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Researchers from the National University of Singapore (NUS) have successfully developed an environmentally-friendly food packaging material that is free from chemical additives, by fortifying natural chitosan-based composite ...
Materials Science
Feb 23, 2016
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More than one third of the total plastic production in Europe—about 14 million tonnes per year—are polyolefins, also known as polyalkenes. This is a family of polymers used for the manufacture of a variety of products, ...
Materials Science
Jun 14, 2013
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IBM awarded CEO Virginia Rometty a compensation package valued at $15.4 million during her first year running one of the world's biggest technology companies.
Business
Mar 11, 2013
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