04/05/2017

Novel technique measures warpage in next-gen integrated circuits

As integrated circuit components are coming up against size limits, manufacturers are turning to new approaches based on stacking extremely thin wafers. However, the thin wafers easily warp under the stresses involved in ...

Image: North pole of Enceladus

In the north, Enceladus' surface appears to be about as old as any in the solar system. The south, however, is an entirely different story.

Printing bricks from moondust using the sun's heat

Bricks have been 3-D printed out of simulated moondust using concentrated sunlight – proving in principle that future lunar colonists could one day use the same approach to build settlements on the moon.

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