Elpida Completes Development of Cu-TSV (Through Silicon Via) Multi-Layer 8-Gigabit DRAM
Elpida Memory today announced that it has completed development of a Cu-TSV (Through Silicon Via) multi-layer 8-Gigabit DRAM.
Elpida Memory today announced that it has completed development of a Cu-TSV (Through Silicon Via) multi-layer 8-Gigabit DRAM.
Electronics & Semiconductors
Aug 31, 2009
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Almost all computer chips use two types of transistors: one called p-type, for positive, and one called n-type, for negative. Improving the performance of the chip as a whole requires parallel improvements in both types.
Electronics & Semiconductors
Jan 2, 2013
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An energy-recycling computer circuit born at the University of Michigan will enable a new generation of power efficient laptop PCs and servers.
Hardware
Feb 22, 2012
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Presented during the EPFL Middle East research days, a device only 4mm thick can manage an urban power grid a thousand times faster than currently possible.
Electronics & Semiconductors
Jun 9, 2011
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For the first time, researchers from CNRS France and ETH Zurich have succeeded in producing high-performance high-electron-mobility transistors (HEMTs) made of gallium nitride (GaN) on a silicon(110) wafer. This makes these ...
Electronics & Semiconductors
Sep 21, 2011
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(Phys.org)—A research team from Stanford University led by associate professor Subhasish Mitra and headed by Professor Philip Wong, has demonstrated a computer chip based on transistors made out of carbon nanotubes. The ...
Intel Corp. on Monday unveiled a new line of computer chips as part of the tech giant's efforts to gain traction in the fast-growing mobile sector.
Hardware
May 6, 2013
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(PhysOrg.com) -- AMD is in the process of designing a server chip with up to 16-cores. Code named Interlagos, the server chip will contain between 12 and 16 cores and will be available in 2011.
After a year like last year, Advanced Micro Devices Inc. is shooting for some sort of comeback. The chipmaker lost a boatload of money in 2012 as its sales of personal computer processor chips plunged amid a downturn in the ...
Hardware
May 30, 2013
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IBM today announced a materials science breakthrough at the molecular level that could pave the way for a new class of non-volatile memory and logic chips that would use less power than today's silicon devices like cell phones. ...
Electronics & Semiconductors
Mar 21, 2013
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