3M and IBM announced that the two companies plan to jointly develop the first adhesives that can be used to package semiconductors into densely stacked silicon “towers.” The companies are aiming to create a new ...
Electronics & Semiconductors
Sep 8, 2011
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Samsung Electronics today announced the development of 32 gigabyte (GB) double data rate-3 (DDR3) registered dual Inline memory modules (RDIMMs) that use three dimensional (3D) through silicon via (TSV) package technology.
Hardware
Aug 18, 2011
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Elpida Memory today announced that it has begun sample shipments of the industry's first DDR3 SDRAM (x32-bit I/O configuration) made using TSV (Through Silicon Via) stacking technology. The sample is a low-power 8-gigabit ...
Electronics & Semiconductors
Jun 28, 2011
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Elpida Memory today announced that its researchers have developed the technology to mass manufacture a 0.8mm four-layer DRAM package, the thinnest memory device in the DRAM industry.
Electronics & Semiconductors
Jun 22, 2011
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China will expand a ban on free shopping bags, state media said, as it tries to further curb its addiction to plastic in a bid to rid the country of "white pollution" that clogs waterways, farms and fields.
Environment
May 29, 2011
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With each European using 500 plastic bags per year, and tonnes of plastic littering the Mediterranean, the European Commission may ban them from stores or tax them to combat pollution.
Environment
May 18, 2011
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NXP Semiconductors today announced the world’s smallest logic plastic packages measuring 0.9 x 1.0 x 0.35 mm with 0.3 mm pitch.
Electronics & Semiconductors
Apr 1, 2011
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Scientists are reporting on a new material containing an ingredient used to make bricks that shows promise as a transparent coating for improving the strength and performance of plastic food packaging. Called "nano-bricks," ...
Nanomaterials
Mar 28, 2011
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A software package designed to minimize the potential risks of synthetic biology for the nation's defense and security is now available to the gene synthesis industry and synthetic biology community in an open-source format.
Biotechnology
Mar 21, 2011
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SanDisk Corporation, the global leader in flash memory cards, today announced its next generation of iNAND and iNAND Ultra embedded flash drives featuring smaller and thinner form factors. Available in packages as small as ...
Hardware
Feb 14, 2011
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