Engineer shrinks 'U' logo

In an example of how a technology wonk displays school spirit, an engineer has created a golden University of Utah logo that is smaller than the width of an average human hair.

Researchers report breakthrough in narrow pitch interconnects

Imec researchers set major step towards 20nm half pitch interconnects with the realization of electrically functional copper lines embedded into silicon oxide using a spacer-defined double patterning approach.

The Shrinky Dink solution

Toys don't usually inspire high-tech innovation, but Michelle Khine's childhood favorite did just that.

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