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Infineon Technologies AG (FSE/NYSE: IFX) today announced that it has successfully tested the industry’s first advanced memory buffer (AMB) test chip for next generation server modules using Double Data Rate2 (DDR2) Dynamic ...
Infineon Technologies AG today announced that it has successfully tested the industry’s first advanced memory buffer ( AMB ) test chip for next generation server modules using Double Data Rate2 (DDR2) Dynamic Random Access ...
IBM today revealed a breakthrough chip morphing technology, enabling a new class of semiconductor products that can monitor and adjust their functions to improve their quality, performance and power consumption without human ...
New Devices Combine Two 256 Megabit Mobile RAM Devices in a Multi-Chip Package Elpida Memory, Inc. (Elpida), Japan's leading global supplier of Dynamic Random Access Memory (DRAM), today announced the availability of its ...
Elpida Memory, Inc (Elpida), Japan's leading global supplier of Dynamic Random Access Memory (DRAM), today announced that it will begin mass production of DDR2 SDRAM using advanced 0.10-micron process technology in August ...
First 128Mb Burst 1.5 Generation CellularRAM Device Manufactured on Micron’s Award-Winning 6F² Array Architecture Micron Technology, Inc., today announced sample availability of the first 128 Megabit (Mb), burst ...
Samsung Electronics Co., Ltd., the world leader in advanced semiconductor memory technology, today broke ground on the second stage of the expansion of its Austin memory chip fabrication plant.The 34,000 square foot expansion ...
Renesas Technology Corp. today announced the development of the SH7780, a 32-bit microprocessor incorporating the SH-4A, the high-end CPU core in the SuperH™* 1 Family, and a PCI bus * 2 controller (PCIC). It is designed ...
0.11 micron, x16, DDR400 Devices are Ideal for Standard and High Definition TV Elpida Memory, Inc (Elpida), Japan's leading global supplier of Dynamic Random Access Memory (DRAM), today announced its latest offering in ...
Optical lithography may currently offer the advantage of high wafer throughputs, but to sustain in the long term and compete with the next generation lithography (NGL) technologies, it must deliver finer resolution and achieve ...
