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Dec 4, 2004

Elpida Memory Develops 90 nm Silicon Wafer Process for High-Performance DDR2 SDRAM

Advanced Process Technology Boosts Production Efficiency for Superior DDR2 Products Elpida Memory, Inc., Japan's leading global supplier of Dynamic Random Access Memory (DRAM), today announced that is has developed its ...

Sep 20, 2004

Industry's First 2-Gigabit DDR2 SDRAM

Samsung Electronics Co., Ltd., the leader in advanced semiconductor technology, today announced the industry's first 2-Gigabit (Gb) DDR2 SDRAM utilizing 80-nanometer (nm) process technology. The high density, DDR2 solution ...

Sep 13, 2004

Micron Qualifies 288 Megabit RLDRAM II Device

Micron supports networking and video imaging markets with RLDRAM II products Micron Technology, Inc., today announced qualification of the 288 megabit (Mb) reduced latency DRAM II (RLDRAM® II) products now available in ...

Sep 9, 2004

Industry's first mass production of DRAM in 90nm technology

Samsung Electronics Co., Ltd., the world leader in advanced semiconductor memory technology, announced today the industry's first mass production of 90nanometer (nm) 512Mb DDR SDRAM on 300mm base wafers. Samsung pioneered ...

Sep 7, 2004

Toshiba, NEC Electronics, and Fujitsu Agree on Common Specifications for PSRAM

Toshiba Corporation, NEC Electronics Corporation, and Fujitsu Limited today announced that they have agreed on standard interface specifications for Pseudo Static Random Access Memory (PSRAM)(1) with burst mode. Based on ...

Sep 6, 2004

Samsung Electronics Develops Industry’s Highest–Capacity Multi-Chip Package for 3G Mobile Phones

Samsung Electronics Co., Ltd., the world leader in advanced semiconductor memory technology, announced today that it has developed a 2.5Gigabit (Gb) four-die multi-chip package (MCP) designed for use in third generation mobile ...

Aug 23, 2004

Poseidon Design Systems Introduces ESL Tools That Analyze, Optimize and Accelerate Processor-Based Designs

Triton Tool Suite Enables Designers to Trade off Performance, Power and Cost for SoCs, Platform ASICs, Structured Arrays and FPGAs Poseidon Design Systems, Inc. today announced an Electronic System Level (ESL) tool suite ...

Aug 22, 2004

ProMOS Technologies 0.12um 256Mb DDR DRAM Passes IBM and Dell Product Qualification

ProMOS Technologies, one of the global leading memory makers, today (August 19) announced that its self-developed 0.12-micron 256Mb DDR DRAM passed IBM and Dell OEM customers’ stringent product qualification, demonstrating ...

Aug 12, 2004

SAMSUNG Surpasses 10 Million-Milestone In DDR2 SDRAM

Aggregate sales of the next-generation, high-speed chips break the 10 million mark in July Samsung Electronics sold its 10 millionth (256Mb equivalent) DDR2 DRAM chip in July, leading the latest transition in the mainstream ...

Aug 10, 2004

Optical Lithography Refinement Essential to Meet Increasing Challenge from NGL Technologies

Optical lithography may currently offer the advantage of high wafer throughputs, but to sustain in the long term and compete with the next generation lithography (NGL) technologies, it must deliver finer resolution and achieve ...

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