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Feb 17, 2005

Samsung Demonstrates World's First DDR 3 Memory Prototype

Samsung Electronics Co., Ltd., has produced the world's first DDR3 (double-data-rate) DRAM (dynamic random access memory) prototype chip. The new 512Mb DDR3 DRAM, can process data at the extraordinary rate of 1,066Mbps, and ...

Feb 16, 2005

New DRAM circuit design approach for gigabit-era DRAM

Hitachi, Ltd., in cooperation with Elpida Memory, Inc. announced that they have developed a new methodology for memory-array design, Concordant Memory Design Using Statistical Integration, which gathers statistics on device ...

Feb 7, 2005

PISMO Advisory Council Launched to Define External Memory Interface Standard

A group of leading semiconductor companies today announced the launch of the PISMO™ Advisory Council, the industry’s first organization focused on streamlining system-level memory validation and test. The group will define ...

Jan 27, 2005

Hynix and ProMOS Sign Contract for Long-term Strategic Alliance

Hynix Semiconductor Inc. and ProMOS Technologies Inc., the high quality DRAM manufacturer today announced the signing of a definitive agreement for a long-term strategic alliance will further enhance the competitiveness of ...

Jan 26, 2005

Samsung to Produce World's Fastest XDR DRAM

Samsung Electronics, the world leader in advanced memory technology, announced that it has begun mass producing 256Mb XDR (short for "eXtreme Data Rate") DRAM, a next-generation memory device for multimedia applications. ...

Jan 19, 2005

Samsung Says High-bandwidth 512Mb Memory Will Enable 3D Graphics in Smaller Mobile Phones

Samsung Electronics, the world leader in advanced memory technology, today announced that it has completed the world's first working prototype of a 512Mb mobile DRAM device that operates up to 333Mbps, transmitting 32 bits ...

Jan 17, 2005

Samsung Supplies Multi-chip Packages to Sony for PlayStation Portable

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, announced that it will supply high-performance multi-functional multi-chip package (MCP) solutions for Sony Corporation's PlayStation Portable ...

Jan 13, 2005

Elpida's 'Super Self Refresh' Memory Achieves Industry's Lowest Self Refresh Current, Extending Battery Life

Self Refresh Current Reduced by 95 Percent versus Standard DDR SDRAM with No Performance Trade-off Elpida Memory, Inc (Elpida), Japan's leading global supplier of Dynamic Random Access Memory (DRAM), today announced that ...

Jan 10, 2005

Samsung Develops World's First Eight-Die Multi-Chip Package Technology for Multimedia Cell Phones

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today announced that it has developed the world's first eight-die multi-chip package (MCP) technology, designed for use in high-capacity mobile ...

Jan 10, 2005

Philips targets DDR2 memory modules with new high-speed registers

Designed to optimize memory performance, family includes fastest registers on the market As memory modules have evolved from slower single data rate (SDR) solutions to double data rate (DDR), the need for increasingly precise ...

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