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Advanced Technology Contributes to Increased Capacity and Smaller Device Size Elpida Memory, Inc., Japan's leading global supplier of Dynamic Random Access Memory (DRAM), today announced that it has started production of ...
Infineon Technologies AG, demonstrating its leadership as memory supplier, today announced new high-density memory products for notebook computer and graphics applications, designed to help system manufacturers meet growing ...
Delivers up to 4x Performance Improvement in 3D Graphics and Other Applications Rambus Inc., one of the world's premier technology licensing companies specializing in high-speed chip interfaces, today unveiled an architectural ...
3.2 GHz Operation Enables 6.4 Gigabytes per second (GB/s) Bandwidth within a Single Device Elpida Memory, Inc., Japan's leading global supplier of Dynamic Random Access Memory (DRAM), today announced the availability of ...
Samsung Electronics Co., Ltd., the leader in advanced semiconductor technology, today delivered an extremely optimistic outlook on the market migration to mobile technology before 700 IT technology enablers at the second ...
Elpida Memory, Inc. (Elpida), Japan's leading global supplier of Dynamic Random Access Memory (DRAM), today announced the industry's first 256 Megabit DDR2 SDRAM devices that achieve 800 Megabits per second (Mbps) operation. ...
New ZrO2 Dielectric Material Increases Performance of CMOS-Compatible Embedded DRAM NEC Electronics Corporation today announced its new metal insulator metal (MIM) technology for 90 nanometer embedded DRAM (eDRAM), called ...
Focus is on FB-DIMM Memory, Intel's *T Silicon Innovations Intel Corporation today introduced a product development kit (PDK) to accelerate the adoption of a new computer memory technology, called Fully-Buffered Dual In-Line ...
Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today announced that it is mass producing the world's largest-capacity multi-chip package (MCP). The new 2.5Gb MCP will enable multimedia-intensive ...
IBM introduced the eServer X3 architecture, the culmination of a three year, one hundred-million-dollar development effort, to bring mainframe-inspired capabilities and sophisticated high-end technology to the company's next-generation ...
