In Brief: Winbond buys laser system for chip plant
U.S. laser producer ESI has received an order from Winbond Electronics for a semiconductor link processing system to be used in Winbond's 300mm fab plant in Taiwan.
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U.S. laser producer ESI has received an order from Winbond Electronics for a semiconductor link processing system to be used in Winbond's 300mm fab plant in Taiwan.
The World Trade Organization said this week it would seat a panel to look at the tariff dispute between South Korea and Japan involving DRAM memory chips.
Memory cards, USB ports and iPods are about to get smaller and cheaper to produce, according to a company that has just unveiled 4 bit per cell NAND flash technology.
A university study suggests Japan is falling behind other nations in the production of Dynamic Random Access Memory (DRAM) chips for personal computers.
Elpida Memory announced recently that it has successfully developed defect repair technology that leads to dramatic improvement of data retention, and has also identified the physical phenomena that dominate DRAM retention ...
Samsung Electronics announced today that it has developed a small-footprint, wafer-level processed stack package (WSP) of high density memory chips using 'through silicon via' (TSV) interconnection technology. WSP actually ...
Smaller, lighter, more compact devices that can do more and more, work faster, and juggle more data -- these demands are pushing conventional semiconductor technology up against its limits. In the future, plastics will have ...
Infineon Technologies will complete the spinoff of its memory-products unit ahead of schedule later this spring.
Samsung Electronics announced today that it is the first manufacturer in the industry to begin mass producing DDR2 DRAM - 512 Megabit (Mb) - on an 80 nanometer scale.
For decades, high energy experimental physicists have struggled with a fundamental problem: they simply have too much data to analyze quickly and in its entirety.