Atomic nitrogen route to new 2-D semiconductors

A simple and non-destructive fabrication technique could aid the manufacture of more energy efficient two-dimensional (2-D) films needed to transform the electronics industry.

Enabling fabrication beyond 7nm

How did we get from the Palm Pilots of the 90s to the ultra-powerful smart phones of today? In large part, because of scaling, where integrated circuits are made with smaller feature sizes fitting more and more circuit elements ...

New device traps particulates, kills airborne pathogens

A new device called a soft x-ray electrostatic precipitator protected immunocompromised mice from airborne pathogenic bacteria, viruses, ultrafine particles, and allergens, according to a paper published online ahead of print ...

Semiconductor devices: Under mounting stress

The recently developed ability to measure physical changes in silicon when processed into microelectronic devices could improve fabrication techniques for even smaller circuits.

Plasma etching pushes the limits of a shrinking world

Plasma etching (using an ionized gas to carve tiny components on silicon wafers) has long enabled the perpetuation of Moore's Law -- the observation that the number of transistors that can be squeezed into an integrated circuit ...

Making manufacturing ultrapure hydrogen gas easier than ever

Pure hydrogen (H2) is an important chemical widely used in the chemical industry, many semiconductor fabrication processes, as well as in Polymer Electrolyte Membrane (PEM) fuel cells. Almost all of the hydrogen (H2) gas ...

New Sensor to Drastically Cut Water Usage During Chip Making Process

Semiconductor Research Corporation (SRC), University of Arizona and Arizona State University researchers have shown a new, exclusive way to dramatically conserve the amount of water needed to manufacture semiconductors. Using ...

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