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Jun 27, 2005

0.4-V DRAM array technology using twin cells for next generation mobile devices

Enabling the longer retention time and fast read/write operation under low voltage condition Hitachi, Ltd. in cooperation with Elpida Memory, Inc., have proposed a new DRAM (*1) circuit design enabling 0.4-V operation. The ...

Jan 27, 2006

Korean DRAM finds itself shut out of Japan

Japan may claim that the countervailing duty it slaps against Korean DRAM chip maker Hynix from today is just a protest against unfair trade practices and to curb dumping, but there's a widespread belief that the country ...

Electronics & Semiconductors Nov 18, 2011

Elpida develops next-generation mobile DRAM product

Elpida Memory, the third largest Dynamic Random Access Memory (DRAM) manufacturer in the world, today announced that it had developed the industry's first 4-gigabit next-generation mobile memory chips for smart phones, tablet ...

Electronics & Semiconductors Dec 11, 2007

IMEC increases performance of high-k metal gate planar CMOS and FinFETs

At today’s IEEE International Electron Devices Meeting, IMEC reports significant progress in improving the performance of planar CMOS using hafnium-based high-k dielectrics and tantalum-carbide metal gates targeting the ...

Dec 8, 2005

A 20-year old mystery mechanism influencing DRAM cell retention time fluctuation clarified

Hitachi, Ltd., in cooperation with Elpida Memory announced today that they have identified that the leakage current fluctuation of the p-n junction*1) is the primary factor influencing the charge retention time fluctuation ...

Jul 13, 2005

Elpida Memory's 512 Megabit Mobile RAM Device Fits in Smaller Package for 3G Phones

90 nm Process Technology Enables Smaller Die Size, Easier Implementation in Multi-Chip-Package and System-in-Package Designs Elpida Memory, Inc., Japan's leading global supplier of Dynamic Random Access Memory (DRAM), today ...

Electronics & Semiconductors Aug 31, 2009

Elpida Completes Development of Cu-TSV (Through Silicon Via) Multi-Layer 8-Gigabit DRAM

Elpida Memory today announced that it has completed development of a Cu-TSV (Through Silicon Via) multi-layer 8-Gigabit DRAM.

Electronics & Semiconductors Jul 14, 2008

IMEC reports major progress in EUV

IMEC reports functional 0.186µm2 32nm SRAM cells made with FinFETs from which the contact layer was successfully printed using ASML’s full field extreme ultraviolet (EUV) Alpha Demo Tool (ADT). Applied Materials, using ...

Apr 20, 2005

Elpida Begins Production of DDR2 SDRAM Using 90 nm Process Technology

Advanced Technology Contributes to Increased Capacity and Smaller Device Size Elpida Memory, Inc., Japan's leading global supplier of Dynamic Random Access Memory (DRAM), today announced that it has started production of ...

Electronics & Semiconductors Jun 13, 2007

IMEC advancing state-of-the-art in FinFETs

At this week’s VLSI Symposium, IMEC presents significant progress in the manufacturability, circuit performance and reliability of FinFETs. The results advance FinFET process technology towards being a candidate for the ...

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