IBM microprocessors to power the new Wii U system from Nintendo

June 8, 2011
IBM's state-of-the-art 300mm chip plant in East Fishkill, N.Y., will be the manufacturing facility for the new game chip the company is building for Nintendo's new game console due to hit store shelves in 2012.

IBM announced that it will provide the microprocessors that will serve as the heart of the new Wii U system from Nintendo.  Unveiled today at the E3 trade show, Nintendo plans for its new console to hit store shelves in 2012.

The all-new, Power-based microprocessor will pack some of IBM's most advanced technology into an energy-saving silicon package that will power Nintendo's brand new entertainment experience for consumers worldwide. IBM's unique embedded DRAM, for example, is capable of feeding the multi-core processor large chunks of data to make for a smooth entertainment experience.

IBM plans to produce millions of chips for Nintendo featuring IBM Silicon on Insulator (SOI) technology at 45 nanometers (45 billionths of a meter). The custom-designed chips will be made at IBM's state-of-the-art 300mm semiconductor development and manufacturing facility in East Fishkill, N.Y. 

The relationship between IBM and Nintendo dates to May 1999, when IBM was selected to design and manufacture the central for the Nintendo GameCube system. Since 2006, IBM has shipped more than 90 million chips for Nintendo systems.

"IBM has been a terrific partner for many years.  We truly value IBM's commitment to support Nintendo in delivering an entirely new kind of gaming and entertainment experience for consumers around the world," said Genyo Takeda, Senior Managing Director, Integrated Research and Development, at Nintendo Co., Ltd.  

"We're very proud to have delivered to Nintendo consistent technology advancements for three generations of entertainment consoles," said Elmer Corbin, director, IBM's custom chip business. "Our relationship with underscores our unique position in the industry -- how we work together with clients to help them leverage IBM technology, intellectual property and research to drive innovation into their own core products."
 
Built on the open, scalable Power Architecture base, custom processors exploit the performance and power advantages of proven silicon-on-insulator (SOI) technology.

The inherent advantages of the technology make it a superior choice for performance-driven applications that demand exceptional, power-efficient processing capability – from entertainment consoles to supercomputers.

Explore further: IBM's new Power 5 chips based on SOI and copper interconnects.

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EWH
1 / 5 (1) Jun 09, 2011
Marketing hucksterism. This sort of puffed-up press release should never have been repeated.

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