Toshiba's low-power SRAM chip aims to cut device drain

(Phys.org)—Toshiba has announced a low-power embedded SRAM memory chip which may make future mobile devices last longer. Presenting its SRAM developments at the International Solid-State Circuit Conference in San Francisco ...

Light connects two worlds on a single chip

For the first time, researchers of the University of Twente succeeded in connecting two parts of an electronics chip using an on-chip optical link. A light connection could be a safe way of connecting a high-power component ...

Elpida achieves 4-Layer 0.8mm mobile RAM package

Elpida Memory today announced that its researchers have developed the technology to mass manufacture a 0.8mm four-layer DRAM package, the thinnest memory device in the DRAM industry.

page 7 from 11