SanDisk and Toshiba today announced the co-development of multi-level cell (MLC) NAND flash memory using 32-nanometer process technology to produce a 32-gigabit (Gb) 3-bits-per-cell (X3) memory chip. The breakthrough introduction ...
Nanophysics
Feb 11, 2009
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Samsung Electronics announced today that it is mass producing the world's fastest embedded memory – the industry's first eMMC 5.0 devices – in 16 gigabyte (GB), 32GB and 64GB densities for next-generation smartphones ...
Hardware
Jul 30, 2013
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SanDisk Corporation, the global leader in flash memory cards, today announced its next generation of iNAND and iNAND Ultra embedded flash drives featuring smaller and thinner form factors. Available in packages as small as ...
Hardware
Feb 14, 2011
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TDK Corporation has developed the eSSD series, a single chip 3Gbps SSD with serial ATA interface that uses multi-chip technology to integrate the TDK SSD controller GBDriver RS3 with NAND type flash memory in a single package. ...
Hardware
Mar 23, 2012
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Intel Corporation announced today its fastest, most robust client/consumer solid-state drive (SSD) to date, the Intel Solid-State Drive 520 Series (Intel SSD 520), a 6 gigabit-per-second (gbps) SATA III SSD produced using ...
Hardware
Feb 7, 2012
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All-optical logic gates are essential elements for the optical processing of information, since they overcome the fundamental difficulties of their electronic counterparts, in particular the limited data transfer speed and ...
Optics & Photonics
Feb 13, 2023
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Samsung Electronics announced today the industry’s first production of a 3-bit-cell (3bit), 64 gigabit (Gb) NAND flash using 20 nanometer (nm)-class process technology. The highly advanced new chip can be used in high-density ...
Hardware
Oct 13, 2010
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SanDisk Corporation today announced that the SanDisk iNAND Embedded Flash Drive (EFD) product line offers new performance enhancement features that go beyond the existing e.MMC 4.4 specification. The new features improve ...
Hardware
Feb 16, 2010
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Samsung Electronics announced today that it has developed the world's thinnest multi-die package, one that measures a mere 0.6mm in height. Designed initially for 32 gigabyte (GB) densities, the new memory package is just ...
Electronics & Semiconductors
Nov 5, 2009
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Toshiba today announced that it will launch two 2.5-inch form factor Hybrid Drives that bring new levels of high speed read and write performance to notebook and desktop PCs. The new drives, which integrate high capacity ...
Hardware
Sep 25, 2012
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