Toshiba Launches 128GB Embedded NAND Flash Memory Module
(PhysOrg.com) -- Toshiba announced today the first ever 128GB embedded flash memory chip using 32 nanometer processes. The entire design is less than 0.06 inches thick.
(PhysOrg.com) -- Toshiba announced today the first ever 128GB embedded flash memory chip using 32 nanometer processes. The entire design is less than 0.06 inches thick.
Samsung Electronics today introduced the first solid state drive (SSD) utilizing high-performance toggle-mode DDR NAND. The new 512 gigabyte (GB) SSD provides electronic data processing application designers with advanced ...
Hardware
Jun 17, 2010
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South Korea's Hynix Semiconductor said Thursday it posted record quarterly sales in the three months to March on the back of strong demand, achieving a third straight quarter in the black.
Business
Apr 22, 2010
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Samsung Electronics announced the industry's first production of 20 nanometer class NAND chips for use in Secure Digital (SD) memory cards and embedded memory solutions. Based on this cutting-edge technology, the introduction ...
Hardware
Apr 20, 2010
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(PhysOrg.com) -- Although today flash memory is primarily used as a removable storage medium, it's currently becoming more and more appealing for a wider variety of applications. Moving beyond memory cards and flash drives, ...
SanDisk Corporation today announced that the SanDisk iNAND Embedded Flash Drive (EFD) product line offers new performance enhancement features that go beyond the existing e.MMC 4.4 specification. The new features improve ...
Hardware
Feb 16, 2010
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Intel Corporation and Micron Technology, Inc. today announced the world's first 25-nanometer (nm) NAND technology, which provides a more cost-effective path for increasing storage capacity in such popular consumer gadgets ...
Electronics & Semiconductors
Feb 1, 2010
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(PhysOrg.com) -- Samsung Electronics has announced two new flash chip storage devices for mobiles: a removable 32-Gbyte micro SD (secure digital) card and a 64-Gbyte moviNAND flash memory module. Both are based on Samsung's ...
Toshiba Corporation today announced the launch of a 64 gigabyte (GB) embedded NAND flash memory module, the highest capacity yet achieved in the industry.
Electronics & Semiconductors
Dec 15, 2009
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Samsung Electronics announced today that it has developed the world's thinnest multi-die package, one that measures a mere 0.6mm in height. Designed initially for 32 gigabyte (GB) densities, the new memory package is just ...
Electronics & Semiconductors
Nov 5, 2009
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