Researchers at MIT and elsewhere have developed a new combination of methods that can provide detailed information about the microstructure of polycrystalline metals.
Condensed Matter
Jul 6, 2016
0
1315
Jupiter's moon Europa is under a constant gravitational assault. As it orbits, Europa's icy surface heaves and falls with the pull of Jupiter's gravity, creating enough heat, scientists think, to support a global ocean beneath ...
Space Exploration
Apr 14, 2016
28
3138
The ability of shape memory alloys, used as materials for medical stents, to revert to their original shape after an increase in temperature is suppressed at nanometer grain sizes due to effects related to the larger proportion ...
Nanophysics
Feb 24, 2016
0
11
The Center for Integrated Nanostructure Physics (CINAP) within IBS has reported results correlating the flake merging angle with grain boundary (GBs) properties, and proven that increasing the merging angle of GBs drastically ...
Nanomaterials
Jan 27, 2016
0
6
Researchers have discovered a new stretchable, transparent conductor that can be folded or stretched and released, resulting in a large curvature or a significant strain, at least 10,000 times without showing signs of fatigue.
Nanophysics
Sep 21, 2015
1
778
A core concern for any structural material is maintaining a prolonged, effective service life. Notably, critical metal alloy failures typically initiate beyond the naked eye, where intergranular (between the grains) oxidation ...
Materials Science
Aug 7, 2015
0
39
The same quality that buffers a raincoat against downpours or a pan against sticky foods can also boost the performance of solar cells, according to a new study from UNL engineers.
Nanomaterials
Jul 20, 2015
0
42
Researchers have solved the long-standing conundrum of how the boundary between grains of graphene affects heat conductivity in thin films of the miracle substance—bringing developers a step closer to being able to engineer ...
Nanomaterials
Jun 16, 2015
0
1589
Yale researchers have proposed a new model to explain the drop in elastic stiffness in the middle of the Earth's continental lithosphere.
Earth Sciences
Jun 15, 2015
0
39
Today, at the IEEE IITC conference, nano-electronics research center imec and Tokyo Electron Limited (TEL) presented a direct Cu etch scheme for patterning Cu interconnects. The new scheme has great potential to overcome ...
Electronics & Semiconductors
May 20, 2015
0
21
