Samsung Electronics today announced the industry's first multi-chip package (MCP) with PRAM - for use in mobile handsets, beginning later this quarter
Electronics & Semiconductors
Apr 28, 2010
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The bickering between Apple and Adobe over why Apple's iPhone and its new iPad don't run Adobe's Flash software is giving me a headache.
Business
Feb 11, 2010
10
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Samsung Electronics announced today that it has developed the world's thinnest multi-die package, one that measures a mere 0.6mm in height. Designed initially for 32 gigabyte (GB) densities, the new memory package is just ...
Electronics & Semiconductors
Nov 5, 2009
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(AP) - Adobe Systems says developers for Apple's iPhone will be able to use its video-enabling software, Flash, to create applications for the device for the first time.
Software
Oct 5, 2009
3
0
Intel Corporation and Micron Technology today announced the development of a new 3-bit-per-cell (3bpc) multi-level cell (MLC) NAND technology, leveraging their award-winning 34-nanometer NAND process. The chips are typically ...
Electronics & Semiconductors
Aug 11, 2009
2
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Kingston Technology, the independent world leader in memory products, announced the launch of the world's first 256GB USB flash drive, the Kingston Technology DataTraveler 300. It allows users to carry around a whole digital ...
Hardware
Jul 22, 2009
11
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SanDisk and Toshiba today announced the co-development of multi-level cell (MLC) NAND flash memory using 32-nanometer process technology to produce a 32-gigabit (Gb) 3-bits-per-cell (X3) memory chip. The breakthrough introduction ...
Nanophysics
Feb 11, 2009
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SanDisk Corporation today unveiled its third-generation family of solid-state drives (SSDs). Using multi-level cell (MLC) NAND flash memory technology, SanDisk’s G3 Series establishes new benchmarks in performance and price-performance ...
Hardware
Jan 8, 2009
2
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