Enabling fabrication beyond 7nm

How did we get from the Palm Pilots of the 90s to the ultra-powerful smart phones of today? In large part, because of scaling, where integrated circuits are made with smaller feature sizes fitting more and more circuit elements ...

Semiconductor devices: Under mounting stress

The recently developed ability to measure physical changes in silicon when processed into microelectronic devices could improve fabrication techniques for even smaller circuits.

A 3-D printout for your health

The field of 3-D printing technology is revolutionizing industries across the spectrum, from the arts to electronics. We asked Constantinos Mavroidis, Distinguished Professor of Engineering, to explain how the approach, which ...

Technique streamlines fabrication of 2-D circuits

Exotic 2-D materials hold great promise for creating atom-thin circuits that could power flexible electronics, optoelectronics, and other next-generation devices. But fabricating complex 2-D circuits requires multiple time-consuming, ...

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