(PhysOrg.com) -- A new ceramic material described in this week's issue of the journal Science could help expand the applications for solid oxide fuel cells - devices that generate electricity directly from a wide range of ...
Condensed Matter
Oct 1, 2009
4
0
Silicon photonics researchers from the Optoelectronics Research Centre (ORC) have demonstrated the first all-silicon optical transmitter at 100Gbps and beyond without the use of digital signal processing.
Optics & Photonics
Nov 16, 2020
1
161
(Phys.org) —In a pellet of glass the size of an apple seed, University of Michigan engineering researchers have packed seven devices that together could potentially provide navigation in the absence of the satellite-based ...
Engineering
Jul 11, 2013
2
0
Japanese researchers from the National Institute of Advanced Industrial Science and Technology (AIST), have developed an all-printed flexible pressure sensor in collaboration with Ajinomoto Co., Inc.
Engineering
Aug 16, 2012
0
0
Researchers at the University of Stuttgart develop a lightweight timber construction system combining robotic prefabrication with computational design and simulation processes, as well as three-dimensional surveying technologies ...
Engineering
Sep 26, 2013
0
0
Engineers at Duke University have produced the world's first fully recyclable printed electronics that replace the use of chemicals with water in the fabrication process. By bypassing the need for hazardous chemicals, the ...
Nanomaterials
Apr 6, 2023
0
89
European researchers have combined computer modelling of quantum mechanics and precision fabrication processes to create novel transparent conductive oxides made to order for a wide range of scientific and consumer applications.
Nanomaterials
Aug 27, 2010
2
0
(Phys.org) —Researchers at the Technion-Israel Institute of Technology have developed and successfully demonstrated a photonic Floquet topological insulator, a new device used to protect the transport of light through a ...
Optics & Photonics
Apr 10, 2013
0
0
As integrated circuit components are coming up against size limits, manufacturers are turning to new approaches based on stacking extremely thin wafers. However, the thin wafers easily warp under the stresses involved in ...
Electronics & Semiconductors
May 4, 2017
0
8
Fabrication of sensors by 3D printing combines speed, freedom of design, and the possibility of using waste as a substrate. Various results have been obtained in a circular economy mode, whereby residues usually thrown away ...
Analytical Chemistry
May 9, 2024
0
75
