Peel-apart surfaces drive transistors to the ledge

Semiconductor manufacturers are paying more attention to two-dimensional materials, such as transition metal dichalcogenides (TMDs), following the discovery, at KAUST, of an epitaxial growth process of single-crystal TMDs ...

Lowering the heat makes new materials possible while saving energy

A new technology developed by Penn State researchers, called Cold Sintering Process (CSP), has opened a window on the ability to combine incompatible materials, such as ceramics and plastics, into new, useful compound materials, ...

Researchers report cybersecurity risks in 3D printing

Additive manufacturing (AM), commonly called 3D printing, is a $4 billion business set to quadruple by 2020. One day, manufacturers may print everything from cars to medicines, disrupting centuries-old production practices. ...

DNA 'origami' could help build faster, cheaper computer chips

Electronics manufacturers constantly hunt for ways to make faster, cheaper computer chips, often by cutting production costs or by shrinking component sizes. Now, researchers report that DNA, the genetic material of life, ...

Reimagining silicon

Silicon (Si) is ubiquitous in modern semiconductor manufacturing. Well-established procedures for its processing, perfected over more than five decades of industrial use, enable a diverse array of electronic devices that ...

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