Semiconductor devices: Under mounting stress

The recently developed ability to measure physical changes in silicon when processed into microelectronic devices could improve fabrication techniques for even smaller circuits.

Folding funnels key to biomimicry

(Phys.org)—Proteins are able to self-assemble into a wide range of highly ordered structures that feature a diverse array of properties. Through biomimicry - technological innovation inspired by nature – humans hope to ...

Low-noise, chip-based optical wavelength converter demonstrated

(Phys.org)—Researchers from the NIST Center for Nanoscale Science and Technology have demonstrated a low-noise device for changing the wavelength of light using nanofabricated waveguides created on a silicon-based platform ...

Company develops conductive yarn for soldier uniforms

(PhysOrg.com) -- Modern military uniforms for servicemen from some countries such as those that serve Great Britain have evolved to the point that batteries and cables are needed for electronic devices that are carried; the ...

Plasma etching pushes the limits of a shrinking world

Plasma etching (using an ionized gas to carve tiny components on silicon wafers) has long enabled the perpetuation of Moore's Law -- the observation that the number of transistors that can be squeezed into an integrated circuit ...

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