Renesas Technology and Matsushita Electric Industrial today announced the development of a technique that achieves stable operation with 45nm process generation bulk CMOS for SRAM (Static Random Access Memory) that can be ...
NTT DoCoMo, Inc., Renesas Technology Corp., Fujitsu Limited, Mitsubishi Electric Corporation, Sharp Corporation, and Sony Ericsson Mobile Communications, today announced that they plan to jointly develop a next-generation ...
Chipmaker Renesas Technology will develop a next-generation large-scale integration circuit, a Japanese daily reported Monday.
Renesas Technology Corp. today announced the development of a massively parallel processor based on a matrix architecture suitable for image and audio multimedia data processing.
Renesas Technology and Grandis, Inc. have agreed to collaborate on the development of 65 nm process MRAM (Magnetic Random Access Memory) employing spin torque transfer writing technology. Renesas Technology will start to ...
Material innovation has replaced scaling as the primary source of performance and feature improvements in leading-edge CMOS semiconductors, IBM technologist Paul Farrar, Jr. told attendees at the ISMI Symposium on Manufacturing ...
Capable of 720 x 480 pixel size encoding/decoding at 30 fps, facilitating development of high-image-quality moving image recording/playback applications Renesas Technology Corp. today announced the development of middleware ...
Renesas Technology Corp. and Hitachi, Ltd. today announced that they have co-developed two high-speed programming technologies for AG-AND (Assist Gate-AND) flash memory*1 devices, high-speed data storage built with multilevel*2 ...
The new technology enables a room-temperature bonding of 10 stacked chip layers in a package with a thickness of 1 mm or less Hitachi, Ltd. and Renesas Technology Corp. today announced a new stacked chip technology that ...
Renesas Technology Corp. today announced the CY25CAH-8F (2.5 V drive) and CY25CAJ-8F (4.0 V drive) strobe control IGBTs for mobile phone cameras, featuring the industry's smallest size of 3.0 mm x 4.8 mm and 0.95 mm (max.) ...
