Briefs: Renesas to make LSIs for 3G mobiles

Chipmaker Renesas Technology will develop a next-generation large-scale integration circuit, a Japanese daily reported Monday.

The Nihon Keizai Shimbun said that the semiconductor manufacturer will collaborate with NTT DoCoMo, Fujitsu, Mitsubishi Electrics and Sharp among others to develop LSIs for third-generation phones.

The plan is to have the product ready for use by the autumn of 2007.

Copyright 2006 by United Press International

Explore further

Renesas Releases Middleware for MPEG-4 and H.264 Compatible Hardware Accelerator

Citation: Briefs: Renesas to make LSIs for 3G mobiles (2006, February 13) retrieved 25 October 2021 from
This document is subject to copyright. Apart from any fair dealing for the purpose of private study or research, no part may be reproduced without the written permission. The content is provided for information purposes only.

Feedback to editors