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Jul 20, 2004

ARM and Broadcom Announce Strategic Partnership to Develop Next-Generation Communications Products

ARM [(LSE:ARM); (Nasdaq:ARMHY)], and Broadcom Corporation(Nasdaq: BRCM), a leading provider of highly integrated semiconductor solutions enabling broadband communications, announced a broad agreement to partner in the development ...

Jul 19, 2004

Security the biggest roadblock to increased adoption of wireless technologies

Wireless technologies are increasingly moving into the spotlight with telecom operators expected to gradually evolve from existing 2G to next-generation 3G infrastructures. 3G wireless technologies promise speeds of up to ...

Jul 13, 2004

New UMTS Products to be Based on TI's OMAP(TM) 2 Architecture and NTT DoCoMo's W-CDMA Technology

Texas Instruments Incorporated (TI) (NYSE:TXN) and NTT DoCoMo, Inc., announced a joint agreement to develop a cost-competitive, multi-mode UMTS (W-CDMA/ GSM/GPRS) chipset to serve the Japanese, U.S. and worldwide 3G handset ...

Jul 6, 2004

Motorola Offers Quick Push-To-Talk over Cellular Installation for Operators with Lower Subscriber Capacity Needs

Same features, functionality of original; new 'PoC Basic' offers lower CAPEX and OPEX to enable rapid entry into global PoC market ARLINGTON HTS, Ill. - July 6, 2004 - Motorola Inc. has just made it easier for smaller wireless ...

Jul 4, 2004

Philips' Breakthrough in W-CDMA Efficiency

Advanced LDMOS technology for best-in-class amplification A major technology development, Philips' new fifth-generation 0.4 µm Laterally Diffused MOS (LDMOS) process enables the creation of RF power amplifier output stages ...

Jun 28, 2004

Infineon Introduces Next-Generation GOLDMOS® Technology and High-Power RF Transistors for High Linear Efficiency

Munich, Germany – June 28, 2004 – Infineon Technologies AG is introducing the next generation of its GOLDMOS® LDMOS (laterally diffused metal-oxide semiconductor) die technology for high-performance, high-power RF transistors ...

Jun 27, 2004

Philips demonstrates BAW filters for System in Package modules for wireless applications

In collaboration with Philips' semiconductors division, scientists at Philips Research have developed an innovative new process technology for producing high-performance BAW (Bulk Acoustic Wave) filters on silicon wafers, ...

Jun 21, 2004

Breakthrough in Wideband-CDMA efficiency

A major technology development, Philips' new fifth-generation 0.4 µm Laterally Diffused MOS (LDMOS) process enables the creation of RF power amplifier output stages for wideband-CDMA (W-CDMA) applications that break the ...

Jun 2, 2004

Philips breaks through Wideband-CDMA basestation efficiency barrier

Royal Philips Electronics today announced a major advance in Laterally Diffused MOS (LDMOS) technology that for the first time will allow Wideband-CDMA (W-CDMA) basestation manufacturers to break through the 30 percent efficiency ...

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