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Researchers from the Moscow Institute of Physics and Technology, along with their colleagues from Germany and the U.S., have achieved a breakthrough in nonvolatile memory devices. The team came up with a unique method for ...
A team at Rice University has determined that a strip of graphite only 10 atoms thick can serve as the basic element in a new type of memory, making massive amounts of storage available for computers, handheld media players, ...
STMicroelectronics, one of the world's leading suppliers of semiconductor devices, will participate as presenter or co-author in fifteen papers at the IEDM 2004 (International Electron Devices Meeting) Conference, which takes ...
Foundry's first 0.25um embedded EEPROM delivers reliability and low power advantages UMC, a world leading semiconductor foundry, today announced that it has developed the foundry's first true embedded EEPROM based on UMC ...
Intel and Micron Technology today introduced a new, finer 20-nanometer (nm) process technology for manufacturing NAND flash memory. The new 20nm process produces an 8-gigabyte (GB) multi-level cell (MLC) NAND flash device, ...
NXP Semiconductors today announced the LPC11U30 series of easy-to-use, very low-power USB microcontrollers based on the ARM® Cortex-M0 processor. Available immediately from major distributors worldwide, the LPC11U30 ...
Transcend Information, Inc. is a leading manufacture of flash memory products. The V20 is small enough to fit into your shirt pocket and has semi-transparent color-band that lights up when in use. With 64 GB of storage space, ...
SanDisk Corporation today introduced an innovative SD flash memory card with built-in USB connectivity. The new product means greater convenience and cost savings for consumers who can just plug the SD card into any SD card ...
A team of scientists from Arizona State University's School of Molecular Sciences and Germany have published in Science Advances online today an explanation of how a particular phase-change memory (PCM) material can work ...
NEC Corporation announced today the development of chip-stacked flexible memory, which can be used to achieve a new system-on-chip (SoC) architecture. The new SoC's architecture consists of separate logic (excluding embedded ...
