A study led by ICFO researchers reports on a highly sensitive CMOS-compatible broadband photodetector by tailoring material defects.
Hardware
Apr 3, 2019
0
4
Samsung Electronics today announced that it has begun mass producing the industry's first 512-gigabyte (GB) embedded Universal Flash Storage (eUFS) 3.0 for next-generation mobile devices. In line with the latest eUFS 3.0 ...
Consumer & Gadgets
Feb 28, 2019
0
5
Qualcomm is introducing a 5G cellular modem chip that the company says is capable of delivering peak wireless download speeds of 7 gigabits per second to mobile devices.
Hardware
Feb 22, 2019
2
8
Researchers at Tohoku University have announced the development of a nonvolatile microcontroller unit (MCU) which achieves both high performance and ultra-low power by utilizing spintronics-based VLSI design technology.
Hardware
Feb 22, 2019
2
84
The electronics market is growing constantly and so is the demand for increasingly compact and efficient power electronic systems. The predominant electronic components based on silicon will in the foreseeable future no longer ...
Hardware
Jan 21, 2019
0
11
For the first time, researchers of the University of Twente succeeded in connecting two parts of an electronics chip using an on-chip optical link. A light connection could be a safe way of connecting a high-power component ...
Hardware
Jan 18, 2019
0
9
Researchers from the University of Tokyo developed a new system to charge electronic devices such as smartphones and smartwatches wirelessly. The method involves a cuttable, flexible power transfer sheet which charges devices ...
Hardware
Jan 9, 2019
0
16
Huawei Technologies Ltd. showed off a new processor chip for data centers and cloud computing Monday, expanding into new and growing markets despite Western warnings the company might be a security risk.
Hardware
Jan 7, 2019
2
143
A research team, led by Professor Tetsuo Endoh at Tohoku University, has successfully developed 128Mb-density spin-transfer torque magnetoresistive random access memory (STT-MRAM) with a write speed of 14 ns for use in embedded ...
Hardware
Dec 28, 2018
0
6
In the FOWINA project, the Fraunhofer Institute for Integrated Circuits IIS in Erlangen and the Fraunhofer Institute for Silicate Research ISC in Würzburg have developed novel color sensors with a special microlens arrangement. ...
Hardware
Dec 3, 2018
0
6
