News tagged with wafer bonding
Ultrathin light-emitting diodes create new classes of lighting and display systems
(PhysOrg.com) -- A new process for creating ultrathin, ultrasmall inorganic light-emitting diodes (LEDs) and assembling them into large arrays offers new classes of lighting and display systems with interesting ...
Aug 20, 2009 |
4.8 / 5 (11) |
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Slimmer Nanorods Good Fit for Next-Gen 3-D Computer Chips
Researchers at Rensselaer Polytechnic Institute have developed a new technique for growing slimmer copper nanorods, a key step for advancing integrated 3-D chip technology.
Mar 17, 2009 |
4.7 / 5 (6) |
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SEMATECH Technologists Detail Process Advances to Accelerate 3D Manufacturing Readiness
With a focus on providing cost-effective and reliable solutions to speed manufacturing readiness of 3D technology options, experts from SEMATECH's 3D interconnect program based at the College of Nanoscale Science and Engineering's ...
Apr 21, 2010 |
4 / 5 (2) |
1
SEMATECH Achieves Submicron 3D IC Bond Alignment Results in Integrated Bonding Tool Platform
Researchers from SEMATECH's 3D Interconnect program based at the College of Nanoscale Science and Engineering's (CNSE) Albany NanoTech Complex have reported advances in wafer-to-wafer bonding alignment accuracies through ...
Jun 10, 2010 |
5 / 5 (1) |
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MHI develops 12-inch wafer bonding machine capable of producing 3-D integrated LSI circuits at room temperature
Mitsubishi Heavy Industries Ltd (MHI) has developed the world's first fully automated 12-inch (300 millimeters) wafer bonding machine, dubbed the "Bond Meister MWB-12-ST," capable of producing 3-dimensionally integrated LSI ...
Jan 16, 2012 |
3 / 5 (1) |
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