Flaky compound to prevent computer chips from getting fried

A research team from Skoltech has improved the properties of a polymer used in 3D printing. By adding boron nitride "flakes" to the photopolymer, the scientists managed to double the material's thermal conductivity. This ...

How repeated spot microdischarges damage microdevices

In microelectronics, devices made up of two electrodes separated by an insulating barrier are subject to multiple of microdischarges - referred to as microfilaments - at the same spot. These stem from residual excited atoms ...

Taking transistors into a new dimension

A new breakthrough could push the limits of the miniaturization of electronic components further than previously thought possible. A team at the Laboratoire d'Analyse et d'Architecture des Systèmes (LAAS) and Institut d'Électronique, ...

Semiconductor devices: Under mounting stress

The recently developed ability to measure physical changes in silicon when processed into microelectronic devices could improve fabrication techniques for even smaller circuits.

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