AMD, IBM Unveil New, Higher Performance, More Power Efficient 65nm Process Technologies

Dec 06, 2005

In papers presented at the International Electron Devices Meeting (IEDM) in Washington, D.C., IBM and AMD today detailed their progress in bringing new, advanced semiconductor process technologies and materials to the 65 nanometer technology generation.

The companies announced that they have successfully combined embedded Silicon Germanium (e-SiGe) with Dual Stress Liner (DSL) and Stress Memorization technology (SMT) on Silicon-On-Insulator (SOI) wafers, resulting in a 40 percent increase in transistor performance compared to similar chips produced without stress technology, while controlling power consumption and heat dissipation.

The new process technologies reduce interconnect delay through the use of lower dielectric constant (lower-K) insulators, which can improve overall product performance and lower power consumption. In addition, the new technologies have shown ability to be manufactured at the 65nm generation and scaleable for use in future generations.

“Our joint work on developing advanced process technologies continues to ensure we can create and provide the highest performance, lowest power processors on the market,” said Nick Kepler, vice president of logic technology development at AMD. “Yet again, we can add another achievement to our list of successes that demonstrate how shared expertise and skills can result in overcoming roadblocks and creating more valuable innovations for customers.”

Additional details about third generation strain technology innovations from AMD and IBM will be disclosed at the 2005 IEEE International Electron Devices Meeting, December 5-7, 2005 in Washington, D.C. This technology was developed as part of the AMD and IBM joint development alliance at AMD’s fabrication facilities in Dresden, Germany, and at the IBM Semiconductor Research and Development Center in East Fishkill, N.Y.

Source: AMD

Explore further: Google eyes nanoparticle platform as part of health rethink

add to favorites email to friend print save as pdf

Related Stories

AMD Expands Semiconductor Technology Alliance With IBM

Nov 02, 2005

Agreement Now Includes Research and Development of Submicron Process Technologies through 2011, Adds Early-Stage Research on Critical Emerging Technologies Targeted at 32 and 22 Nanometer Generations AMD today announced it ha ...

How chips, PCs, services companies are faring

Aug 28, 2012

Personal computer makers have been scrambling to adapt to a technological upheaval unleashed by Apple Inc.'s line of sleek devices such as the iPhone and iPad and by a shift toward Internet-based software services instead ...

A look at recent tech-industry earnings

Jul 18, 2012

Yahoo turned in another lackluster performance in the second quarter, while Intel says the weak global economy is slowing its growth. Earlier, Microsoft warned of a non-cash charge because of disappointing performance in ...

Recommended for you

DNA nanoswitches reveal how life's molecules connect

Jan 30, 2015

A complex interplay of molecular components governs almost all aspects of biological sciences - healthy organism development, disease progression, and drug efficacy are all dependent on the way life's molecules ...

Holes in valence bands of nanodiamonds discovered

Jan 28, 2015

Nanodiamonds are tiny crystals only a few nanometers in size. While they possess the crystalline structure of diamonds, their properties diverge considerably from those of their big brothers, because their ...

Demystifying nanocrystal solar cells

Jan 28, 2015

ETH researchers have developed a comprehensive model to explain how electrons flow inside new types of solar cells made of tiny crystals. The model allows for a better understanding of such cells and may ...

User comments : 0

Please sign in to add a comment. Registration is free, and takes less than a minute. Read more

Click here to reset your password.
Sign in to get notified via email when new comments are made.