New energy-saving flip-flop circuit developed by Toshiba

Toshiba Corporation today announced that it has developed a new flip-flop circuit using 40nm CMOS process that will reduce power consumption in mobile equipment. Measured data verifies that the power dissipation of the new ...

NEC Integrates NanoBridge in the Cu Interconnects of Si LSI

NEC Corporation, in collaboration with the National Institute of Materials Science, today announced the successful integration of NanoBridge, a solid electrolyte non-volatile crossbar switch, in Cu interconnects placed on ...

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