Elpida achieves 4-Layer 0.8mm mobile RAM package

Elpida Memory today announced that its researchers have developed the technology to mass manufacture a 0.8mm four-layer DRAM package, the thinnest memory device in the DRAM industry.

Researchers create a smaller, flexible LED

University of Miami professor at the College of Engineering, Jizhou Song, has helped design an light-emitting diode (LED) light that uses an array of LEDs 100 times smaller than conventional LEDs. The new device has flexibility, ...

AMD has shipped 5 million Fusion processors

(PhysOrg.com) -- Advanced Micro Devices, which you may know better by its initials AMD, has announced that it has shipped out roughly five million of its Fusion processors since their creation. The processors, which are used ...

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