NXP releases world's smallest logic packages for handheld mobility
NXP Semiconductors today announced the world’s smallest logic plastic packages measuring 0.9 x 1.0 x 0.35 mm with 0.3 mm pitch.
Electronics & Semiconductors
Apr 1, 2011
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Page 38 - News tagged with package
'Nano-bricks' may help build better packaging to keep foods fresher longer
Scientists are reporting on a new material containing an ingredient used to make bricks that shows promise as a transparent coating for improving the strength and performance of plastic food packaging. Called "nano-bricks," ...
Nanomaterials
Mar 28, 2011
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Open-source software designed to minimize synthetic biology risks
A software package designed to minimize the potential risks of synthetic biology for the nation's defense and security is now available to the gene synthesis industry and synthetic biology community in an open-source format.
Biotechnology
Mar 21, 2011
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iNAND embedded flash drives enable continued development of powerful mobile devices
SanDisk Corporation, the global leader in flash memory cards, today announced its next generation of iNAND and iNAND Ultra embedded flash drives featuring smaller and thinner form factors. Available in packages as small as ...
Hardware
Feb 14, 2011
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Researchers develop unique combination of elements for thermal nanotape
Semiconductor Research Corporation (SRC) and researchers from Stanford University have developed a novel combination of elements that yields a unique nanostructure material for packaging. This advance should allow longer ...
Nanomaterials
Jan 24, 2011
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Killer paper for next-generation food packaging
Scientists are reporting development and successful lab tests of "killer paper," a material intended for use as a new food packaging material that helps preserve foods by fighting the bacteria that cause spoilage. The paper, ...
Bio & Medicine
Jan 19, 2011
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Packaging that knows when food is going off
Packaging that alerts consumers to food which is starting to go off is being developed by researchers at the University of Strathclyde in Glasgow, Scotland.
Other
Jan 6, 2011
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Dangerous chemicals in food wrappers likely migrating to humans: study
University of Toronto scientists have found that chemicals used to line junk food wrappers and microwave popcorn bags are migrating into food and being ingested by people where they are contributing to chemical contamination ...
Environment
Nov 8, 2010
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Bringing smart textile to industrial manufacturing level
Imec and its project partners announce the launch of the European FP7 (Framework Program) project PASTA (Integrating Platform for Advanced Smart textile Applications) aiming at developing large-area smart textiles. Large-area ...
Engineering
Nov 3, 2010
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NXP announces the first leadless package with tin-plated, solderable side pads
NXP Semiconductors today announced the availability of SOD882D, the industry’s first leadless package with solderable, tin-plated side pads.
Electronics & Semiconductors
Oct 28, 2010
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