Applied Materials, Inc. today added to its extensive line of 3D chip packaging solutions with the launch of its Applied Producer InVia dielectric deposition system. Using a unique CVD process, the InVia system delivers an ...
Electronics & Semiconductors
Mar 30, 2010
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(AP) -- Adobe Systems Inc. said Tuesday that fiscal first-quarter earnings declined on higher expenses, but sales climbed as demand for its design and publishing software improved with the economy.
Business
Mar 23, 2010
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(AP) -- The pay package last year for EMC Corp. CEO Joe Tucci was 23 percent lower than in 2008, a reflection of lower equity awards and cuts to the data-storage company's executive salaries.
Business
Mar 19, 2010
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The small increase in take-home pay that began in April 2009 through the Making Work Pay Credit (MWPC) could mean an unexpected bump in your tax bill, says Cheryl Block, J.D., tax law expert and professor of law at Washington ...
Economics & Business
Mar 16, 2010
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Carnegie Mellon University and Intel Corporation will unveil a new class of materials called solder magnetic nanocomposites that could help streamline the process of computer electronic packaging. The milestone research will ...
Nanomaterials
Jan 19, 2010
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Yahoo Inc., International Business Machines Corp. and Hewlett-Packard Co. have won more than $20 million from the federal government's stimulus package to fund energy-efficiency projects, the U.S. Energy Department said Wednesday.
Energy & Green Tech
Jan 9, 2010
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Industry tracker Gartner forecast on Monday that revenue from Internet-based "cloud computing" will top 14 billion dollars annually by the end of 2013.
Business
Nov 9, 2009
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(PhysOrg.com) -- Software packages that interoperate while providing online users with an overview of their colleagues' work may finally threaten the dominance of email as the world's premier collaboration tool.
Software
Nov 6, 2009
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Microsoft's new-generation Windows 7 operating system hit the ground running, with US sales in its opening days blasting past those of its Vista predecessor, according to NPD Group.
Software
Nov 6, 2009
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Samsung Electronics announced today that it has developed the world's thinnest multi-die package, one that measures a mere 0.6mm in height. Designed initially for 32 gigabyte (GB) densities, the new memory package is just ...
Electronics & Semiconductors
Nov 5, 2009
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