NXP Semiconductors today released its new LFPAK33 portfolio – a range of high switching performance MOSFETs available in an ultra-reliable 3.3-mm x 3.3-mm power package. Unlike many MOSFET packages of this size, LFPAK33 ...
Electronics & Semiconductors
Jun 18, 2012
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NXP Semiconductors today introduced the industry’s first MOSFETs in a 2-mm x 2-mm low-profile DFN (discrete flat no-leads) package with tin-plated, solderable side pads. These unique side pads offer the advantage of ...
Electronics & Semiconductors
Jun 15, 2012
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Toshiba America Electronic Components (TAEC) today announced its DTMOS-IV process, a new-generation of superjunction (SJ) technology for power MOSFETs. Products based on the DTMOS-IV technology will make ideal switching ...
Electronics & Semiconductors
May 10, 2012
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Toshiba America Electronic Components (TAEC) today announced that it has expanded its family of low-voltage, high-speed MOSFETs with new, ultra-efficient 60V and 120V devices that will save space and reduce losses in secondary ...
Electronics & Semiconductors
May 10, 2012
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Toshiba today announced a new family of ultra-high-efficiency, high-speed MOSFETs that deliver significant improvements in trade-off characteristics between low on resistance (RDS(ON)) and low input capacitance (Ciss). The ...
Electronics & Semiconductors
Feb 6, 2012
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