Researchers develop novel atom-thin material heat test

Advanced materials, including two-dimensional or "atomically thin" materials just a few atoms thick, are essential for the future of microelectronics technology. Now a team at Los Alamos National Laboratory has developed ...

Flaky compound to prevent computer chips from getting fried

A research team from Skoltech has improved the properties of a polymer used in 3D printing. By adding boron nitride "flakes" to the photopolymer, the scientists managed to double the material's thermal conductivity. This ...

How repeated spot microdischarges damage microdevices

In microelectronics, devices made up of two electrodes separated by an insulating barrier are subject to multiple of microdischarges - referred to as microfilaments - at the same spot. These stem from residual excited atoms ...

page 1 from 2