Imec announced today that it has integrated an ultra-thin, flexible chip with bendable and stretchable interconnects into a package that adapts dynamically to curving and bending surfaces. The resulting circuitry can be embedded ...
Engineering
Sep 18, 2012
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NEC Corporation announced today the successful demonstration of a low power programmable cell array using a rewritable and nonvolatile solid-electrolyte switch, "NanoBridge," integrated into a 90nm CMOS.
Electronics & Semiconductors
Feb 22, 2011
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The IT state-of-the-art 20 years ago was rapidly ending, and we – and I mean everyone in the industry that made a device with a chip inside of it – needed something new to keep up with the demand for ever-faster, better ...
Electronics & Semiconductors
Nov 15, 2017
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3
"Location, location, location": That age-old key to successful real estate investing has also been the driving mantra in microchip architecture. But with space on the tiny silicon chips at a premium, as demand for faster, ...
Engineering
Aug 8, 2012
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As computer manufacturers cram ever more processing power onto tiny chips, they face a growing problem. The connections between electronic components that measure just a few billionths of a meter across allow electrons to ...
Optics & Photonics
Mar 13, 2013
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When an individual uses Facebook or searches Google, the information processing happens in a large data center. Short distance optical interconnects can improve the performance of these data centers. Current systems utilize ...
Nanophysics
Jan 24, 2017
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During the IEEE IITC conference in Grenoble, the nanoelectronics research center imec and Lam Research Corporation today presented a novel bottom-up prefill technique for vias and contacts. The technique, based on Electroless ...
Electronics & Semiconductors
May 20, 2015
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High-resolution display devices increasingly need ultra-fine pitch assemblies. On that account, display driver interconnection technology has become a major challenge for upscaling display electronics.
Hardware
Nov 14, 2018
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Today, at the IEEE IITC conference, nano-electronics research center imec and Tokyo Electron Limited (TEL) presented a direct Cu etch scheme for patterning Cu interconnects. The new scheme has great potential to overcome ...
Electronics & Semiconductors
May 20, 2015
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21
Nano-electronics research center imec announced today at SEMICON West that it has demonstrated concept and feasibility for pore-sealing low-k dielectrics in advanced interconnects. The method, based on the self-assembly of ...
Electronics & Semiconductors
Jul 15, 2015
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