Their miniature size is their strength - and also their weakness. Be it in cell phones, cars or computers, electronic components are getting smaller and smaller and increasingly powerful. The smaller they are, the faster ...
Engineering
Apr 6, 2009
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Infineon Technologies AG has launched an ultra-high ±5cm resolution, miniature MEMS (Micro Electro Mechanical Systems) pressure sensor for use in mobile and wearable gadgets and IoT (Internet of Things) devices. The DPS310 ...
Engineering
Feb 27, 2015
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Infineon Technologies AG today launches bipolar power modules in solder bond technology to address the specific requirements of cost-effective applications. With these new PowerBlock modules the company expands its already ...
Electronics & Semiconductors
Nov 25, 2014
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German chip maker Infineon Technologies AG says it has agreed to pay $3 billion in cash for California-based semiconductor firm International Rectifier, which produces power-management components used in everything from cars ...
Business
Aug 20, 2014
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German semiconductor maker Infineon revised slightly upward its annual forecast on Wednesday after reporting higher third-quarter earnings and sales.
Business
Jul 30, 2014
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Infineon Technologies AG expands the comprehensive SiC portfolio introducing the 5th generation1200V thinQ! SiC Schottky diodes. The new 1200V SiC diodes feature ultra-low forward voltage even at operating temperatures, more ...
Electronics & Semiconductors
Jun 16, 2014
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(Phys.org)—Leading Internet companies, system integrators and security providers have formed the FIDO Alliance (Fast Identity Online) to revolutionize online authentication with an industry supported standards-based open ...
Internet
Feb 12, 2013
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Infineon Technologies AG today at the "Cartes & Identification" Trade Show in Paris announced the introduction of 90nm SOLID FLASH technology for its new generation of security ICs. With SOLID FLASH, Infineon is the worldwide ...
Electronics & Semiconductors
Dec 7, 2010
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At the Embedded World Show 2010 in Nuremberg today, Infineon Technologies introduced a complete and scalable high-temperature 8-bit microcontroller (MCU) family capable of operating at up to 150 °C ambient temperature, meeting ...
Electronics & Semiconductors
Mar 3, 2010
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Infineon Technologies today at the Mobile World Congress 2010 announced the availability of XMM 6260, the latest platform in its 3G slim-modem family.
Electronics & Semiconductors
Feb 15, 2010
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