(PhysOrg.com) -- Technology is struggling to meet demands for high-performance, specialised computing systems. A European consortium is responding with a new kind of reconfigurable chip that is both efficient and flexible.
Computer Sciences
Apr 21, 2009
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NEC Corporation announced today the development of chip-stacked flexible memory, which can be used to achieve a new system-on-chip (SoC) architecture. The new SoC's architecture consists of separate logic (excluding embedded ...
Electronics & Semiconductors
Feb 10, 2009
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Publishing in the journal International Journal of Extreme Manufacturing, the team led by researchers based at the State Key Laboratory of Fluid Power and Mechatronic Systems deposited different biomaterials simultaneously ...
Biotechnology
Jun 5, 2023
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An innovative electronic smart key system has secured a software system engineer a major national award following a Knowledge Transfer Partnership (KTP) between the University of Lincoln, UK, and Lincoln Security Ltd.
Engineering
Dec 16, 2015
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Computer Science Professor Sal Stolfo and his former student Ang Cui PhD'15, whose cybersecurity research has discovered dozens of serious flaws, have developed Symbiote defense technology that significantly reduces the threat ...
Computer Sciences
Sep 25, 2015
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Today the National Science Foundation (NSF) announced two five-year, center-scale awards totaling $8.75 million to advance the state-of-the-art in medical and cyber-physical systems (CPS).
Engineering
May 15, 2015
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Samsung Electronics today announced a next-generation 64GB embedded multimedia card (eMMC) using 10 nanometer (nm)-class process technology. The new 64Gb NAND memory went into production late last month.
Hardware
Nov 15, 2012
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Samsung Electronics today announced that it has begun volume production of 128-gigabyte (GB) embedded memory for next-generation smartphones, tablets and other mobile devices.
Hardware
Sep 19, 2012
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Toshiba Corporation today announced the development of an innovative low-power, many-core System-on-a-Chip (SoC) for embedded applications in such areas as automotive products and digital consumer products. The prototype ...
Electronics & Semiconductors
Jun 15, 2012
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The continued miniaturization and the increased density of components in today’s electronics have pushed heat generation and power dissipation to unprecedented levels. Current thermal management solutions, usually involving ...
Engineering
Jun 8, 2012
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