Search results for strained silicon

Nanomaterials Mar 16, 2012

Straintronics: Engineers create piezoelectric graphene

In what became known as the 'Scotch tape technique," researchers first extracted graphene with a piece of adhesive in 2004. Graphene is a single layer of carbon atoms arranged in a honeycomb, hexagonal pattern. It looks like ...

Electronics & Semiconductors Mar 7, 2012

Transistors promise more powerful logic, more logical power

Broadly speaking, the two major areas of research at MIT’s Microsystems Technology Laboratory (MTL) are electronics — transistors in particular — and microelectromechanical systems, or MEMS — tiny mechanical ...

Nanophysics Feb 16, 2012

Researchers publish a detailed review of electrical contacts in one and two dimensional nanomaterials

(PhysOrg.com) -- Researchers from the NIST Center for Nanoscale Science and Technology and Sandia National Laboratories have published a detailed review of recent experimental and theoretical work highlighting the unusual ...

Nanomaterials Feb 1, 2012

Researchers find molybdenite may be better suited for integrated logic circuits than graphene

(PhysOrg.com) -- Because of its physical limitations, silicon use in tiny integrated logic circuits will have to one day soon be replaced by something that can work in a smaller state. That is, if we want to see miniaturization ...

Energy & Green Tech Jan 22, 2012

Cambridge team uses solar cells in OLED screen to power smartphones

(PhysOrg.com) -- With the world's showroom floors crammed with prototype smartphones promising advanced functions, bigger displays, stunning resolution, wouldn’t you think the biggest crowd-pleasers would dominate? The ...

Other Jan 18, 2012

Technology, costs, lack of appeal slow e-textbook adoption

Textbooks are often a luxury for college senior Vatell Martin. The accounting major at Virginia State University got by in several courses with study groups and professors' lectures. "It's not that I didn't want to buy," ...

Electronics & Semiconductors Jan 16, 2012

MHI develops 12-inch wafer bonding machine capable of producing 3-D integrated LSI circuits at room temperature

Mitsubishi Heavy Industries Ltd (MHI) has developed the world's first fully automated 12-inch (300 millimeters) wafer bonding machine, dubbed the "Bond Meister MWB-12-ST," capable of producing 3-dimensionally integrated LSI ...

Hi Tech & Innovation Dec 28, 2011

Holographic 3-D looks tantalizingly closer in 2012

(PhysOrg.com) -- Applications like holographic TV have long been relegated as the next big thing in the distant future but a Leuven, Belgium-based R&D lab for nanoelectronics has come up with a process that might bring holographic ...

Electronics & Semiconductors Dec 21, 2011

Record conductivity achieved in strained lattice organic semiconductor

(PhysOrg.com) -- Organic semiconductors could usher in an era of foldable smartphones, better high-definition television screens and clothing made of materials that can harvest energy from the sun needed to charge your iPad, ...

Materials Science Dec 12, 2011

Diamonds and dust for better cement

(PhysOrg.com) -- It's no surprise that humans the world over use more water, by volume, than any other material. But in second place, at over 17 billion tons consumed each year, comes concrete made with Portland cement. Portland ...

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