(PhysOrg.com) -- The USB 3.0 Promoter Group has announced a revised power delivery spec that means significant changes in how consumers will be able to power up tablets, notebooks, and a range of other e-devices. The new ...
20% increase in speed and 1/10 power reductions by employing back-bias control Hitachi, Ltd. announced that it has developed a new SOI (Silicon On Insulator)*1) transistor which dramatically improves speed and lowers power ...
Renesas Technology Corp. today announced the CY25CAH-8F (2.5 V drive) and CY25CAJ-8F (4.0 V drive) strobe control IGBTs for mobile phone cameras, featuring the industry's smallest size of 3.0 mm x 4.8 mm and 0.95 mm (max.) ...
Renesas Technology Corp. and Hitachi, Ltd. today announced that they have co-developed two high-speed programming technologies for AG-AND (Assist Gate-AND) flash memory*1 devices, high-speed data storage built with multilevel*2 ...
(PhysOrg.com) -- Renesas Electronics Corp has announced the development of a near-field wireless communication technology that can transmit data to Bluetooth- and wireless LAN-compatible devices without the use of a battery. ...
Casio Computer Co., Ltd. and Renesas Technology Corp. have agreed to an arrangement whereby Casio will license its wafer level package (WLP) semiconductor device packaging technology to Renesas Technology. The agreement ...
In the 1980s, Sony co-founder Akio Morita fired a verbal missile across the Pacific at Silicon Valley: Japan's supremacy in business and technology would overwhelm U.S. competitors and lead to America's decline.
Renesas Technology Corp. today announced the SH-Mobile3A (product name: SH73380) as part of SH-Mobile Series of mobile phone application processors. The SH-Mobile3A incorporates the latest multimedia processing functions, ...
The new technology enables a room-temperature bonding of 10 stacked chip layers in a package with a thickness of 1 mm or less Hitachi, Ltd. and Renesas Technology Corp. today announced a new stacked chip technology that ...
ARM today announced that it has achieved sample production of the ARM7TDMI core verification chip jointly developed with the Semiconductor Technology Academic Research Center (STARC). The pilot production uses the 90-nm generic ...
