Simulation Program Predicts Resistivity in Nanodevices

Jan 17, 2006

As nanoscale circuits continue to shrink, electrical resistivity increases in the wiring and limits the maximum circuit speed. A new simulation program developed by researchers at the National Institute of Standards and Technology and George Washington University can be used to predict such increases with greater input flexibility and model accuracy than other methods. The software program is expected to help the semiconductor industry design and test devices more efficiently and with greater cost-effectiveness.

On average, an electron can travel only 39 nanometers in pure, bulk copper at room temperature before it is scattered by thermal vibrations of the copper atoms. But, as the dimensions of the wiring shrink, additional scattering by surfaces and grain boundaries within the metal lead to undesirable increases in resistivity. The NIST/GWU computer program, described in a recent paper in Microelectronics Reliability,* enables users to examine how these additional mechanisms alter the resistivity of the thin, narrow metal lines that make up the circuit wiring.

As described in the journal article, NIST researchers used the simulation program to demonstrate that, at critical nanoscale dimensions, electron scattering from surfaces and grain boundaries have effects that are interdependent. This interdependence could not be predicted using methods previously available. The finding has implications for both achievable circuit speed and electrical measurements of the dimensions of thin, narrow lines.

* A.E. Yarimbiyik, H.A. Schafft, R.A. Allen, M.E. Zaghloul, D.L. Blackburn. 2005. Modeling and simulation of resistivity of nanometer scale copper. Microelectronics Reliability. Posted online Dec. 19.

Source: NIST

Explore further: How we can substitute critical raw materials in catalysis, electronics and photonics

add to favorites email to friend print save as pdf

Related Stories

Viruses impaired if their targets have diverse genes

Nov 18, 2014

When a viral infection spread through five genetically identical mice in a row, the virus replicated faster and became more virulent or severe. But when the infection spread one-by-one through five genetically ...

Mantle plumes crack continents

Sep 04, 2014

Using a simulation with an unprecedentedly high resolution, Earth scientists from University of Paris VI and ETH Zurich have shown that magma columns in the Earth's interior can cause continental breakup—but ...

Recommended for you

Semiconductor miniaturisation with 2D nanolattices

Feb 26, 2015

A European research project has made an important step towards the further miniaturisation of nanoelectronics, using a highly-promising new material called silicene. Its goal: to make devices of the future ...

Ultra-small block 'M' illustrates big ideas in drug delivery

Feb 26, 2015

By making what might be the world's smallest three-dimensional unofficial Block "M," University of Michigan researchers have demonstrated a nanoparticle manufacturing process capable of producing multilayered, precise shapes.

User comments : 0

Please sign in to add a comment. Registration is free, and takes less than a minute. Read more

Click here to reset your password.
Sign in to get notified via email when new comments are made.