SiGen Announces Breakthrough in Direct Silicon Bond Substrate Technology

Apr 18, 2006

Silicon Genesis Corporation (SiGen) announced today that it has developed the process modifications to manufacture direct silicon bonded substrates. Direct silicon bond (DSB) substrates are fabricated by bonding and electrically attaching a film of single-crystal silicon of differing crystal orientation onto a base substrate.

As opposed to Silicon-on-Insulator (SOI) substrates, DSB substrates exhibit bulk-like properties and thus are fully compatible with existing EDA and circuit design tools. The attractive cost-of ownership is expected to significantly increase the market opportunity for engineered substrates.

SiGen’s main process developments included modifications to the plasma-activated bond process to allow for a thin interfacial layer. In addition, SiGen focused on eliminating the interfacial layer to produce an electrically robust inter-layer connection.

Francois J. Henley, President and CEO of Silicon Genesis, said, “DSB device technology advantages were recently reported by IBM at the 2005 IEDM Conference. The paper generated substantial interest as an enhanced bulk-like substrate for next-generation nodes. We are excited to have built upon earlier work to develop a process to manufacture these substrates in a cost-effective manner. The key was preserving our high-yield plasma-activation bond process by developing a method to dissolve the interfacial layer through a proprietary post-process step. We are now starting to sample device manufacturers and will be reporting on this technology within the next few months. We believe that the bulk-like properties of DSB substrates combined with its substantial PMOS mobility improvements can generate substantially higher market demand than SOI technology.“

Source: Silicon Genesis

Explore further: Lufthansa outsources IT infrastructure ops to IBM

add to favorites email to friend print save as pdf

Related Stories

How to make a "perfect" solar absorber

Sep 29, 2014

The key to creating a material that would be ideal for converting solar energy to heat is tuning the material's spectrum of absorption just right: It should absorb virtually all wavelengths of light that ...

Researchers develop powerful, silicon-based laser

Sep 29, 2014

A silicon-based laser that lases up to a record 111°C, with a threshold current density of 200 A/cm2 and an output power exceeding 100 mW at room temperature, has been demonstrated by collaborating researcher ...

Ultra-low consumption for the future of electronics

Sep 25, 2014

The European project E2SWITCH is aiming to develop new electronic systems with ultra-low energy consumption. The nine partners, universities, research institutes and companies, are committed to making the ...

Recommended for you

Tablets, cars drive AT&T wireless gains—not phones

2 hours ago

AT&T says it gained 2 million wireless subscribers in the latest quarter, but most were from non-phone services such as tablets and Internet-connected cars. The company is facing pricing pressure from smaller rivals T-Mobile ...

Twitter looks to weave into more mobile apps

2 hours ago

Twitter on Wednesday set out to weave itself into mobile applications with a free "Fabric" platform to help developers build better programs and make more money.

Blink, point, solve an equation: Introducing PhotoMath

4 hours ago

"Ma, can I go now? My phone did my homework." PhotoMath, from the software development company MicroBlink, will make the student's phone do math homework. Just point the camera towards the mathematical expression, ...

Google unveils app for managing Gmail inboxes

4 hours ago

Google is introducing an application designed to make it easier for its Gmail users to find and manage important information that can often become buried in their inboxes.

User comments : 0